As basic chemical materials, many products produced by our company are used widely in electronic industry. Potassium permanganate and sodium permanganate have strong oxidizing property. Glue refuse produced in production process of electronic products can be removed by means of strong oxidizing property of potassium permanganate and sodium permanganate so as to expose copper collars to be interconnected at all layers, improve the structure of hole walls and enhance the adhesion of electrocoppering.
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| Removal of glue refuse | In electronic industry, prepreg can be melted at high temperature produced during boring, to form glue refuse. By means of strong oxidizing property of potassium permanganate/sodium permanganate, glue refuse can be removed through potassium permanganate method and sodium permanganate method. |
Potassium permanganate/sodium permanganate is a kind of strong oxidant, and can be reduced into MnO42- when NaOH concentration is more than 2mol/L. Potassium permanganate/sodium permanganate has stronger oxidizing property in strong acid environment but oxidizes organic substances in alkaline condition more quickly than in acid conditon. Control range of parameters for removal of glue refuse: Mn2+(56.7-63.3g/L), Mn6+(less than or equal to 24g/L), NaOH(43.3-56.7g/L). Glue refuse is dissolved by sodium permanganate for removal. The board before removal of glue refuse has smooth hole wall and no burr compared with that after boring. Glue refuse removal process mainly includes 3 steps like leavening, potassium permanganate and neutralization. 4MnO4-+C epoxy resin+4OH-=4MnO42-+CO2(g) |
